Broadcom 3392 !!top!! File

Introduction

is a next-generation System-on-a-Chip (SoC) designed to significantly boost the performance of cable broadband networks without requiring a full transition to DOCSIS 4.0. By expanding the capabilities of existing DOCSIS 3.1 infrastructure, this chipset allows cable operators to offer "fiber-like" speeds over traditional coaxial cables. Key Technical Specifications represents a major leap over previous hardware like the Broadcom BCM3390 Quad OFDM Bonding broadcom 3392

Sampling began in 2023, with DOCSIS certification achieved in 2024. It is currently in full production. Primary Manufacturers: Vantiva (formerly Technicolor): Launched the , a high-end gateway featuring , 2.5 GbE ports, and 2GB of RAM. Compal Broadband Networks (CBN): Architecture: Quad-core ARMv8 CPU @ 1

• ISP Engineers: Looking to future-proof HFC (Hybrid Fiber-Coax) networks.
• Prosumers: Wanting to over-provision their 2.5 Gbps internet plan.
• Cable Modem OEMs: Designing the next Surfboard or Coda device.

• Architecture: Quad-core ARMv8 CPU @ 1.8 GHz (for handling high routing throughput and AQM).
• DOCSIS Support: Full DOCSIS 3.1 (32x8 channel bonding) with backward compatibility to 3.0.
• OFDM Support: 2x OFDM downstream channels (192 MHz each) + 2x OFDMA upstream channels.
• Interface: Dual 2.5 GbE and one 10 GbE port (NBASE-T compatible).
• Security: Hardware-accelerated DPI (Deep Packet Inspection) and Secure Boot 2.0.

Competition: It positions cable companies to compete directly with high-end Fiber-to-the-Home (FTTH) services. 🛠️ Typical Applications a high-end gateway featuring

Production Ready: The chip passed DOCSIS certification in 2024 and is currently in active production. Why the BCM3392 Matters